Integrated circuit with micro-pores ceramic heat sink

Abstract

An integrated circuit includes an integrated circuit device, a micro-pores ceramic heat sink and a heat conductive medium. The micro-pores ceramic heat sink is placed on a surface of the integrated circuit device. The heat conductive medium is placed in between the integrated circuit device and the micro-pores ceramic heat sink with one surface joined to the integrated circuit device and the other surface to the micro-pores ceramic heat sink.

Claims

1 . An integrated circuit, comprising: an integrated circuit device; a micro-pores ceramic heat sink placed on a surface of the integrated circuit device; and a heat conductive medium placed in between the integrated circuit device and the micro-pores ceramic heat sink with one surface joined to the integrated circuit device and the other surface joined to the micro-pores ceramic heat sink. 2 . The integrated circuit of claim 1 , wherein the heat conductive medium is a thermally conductive aluminum foil tape with adhesive on both sides and has a thickness in a range of 0.1 mm to 0.25 mm. 3 . The integrated circuit of claim 1 , wherein the heat conductive medium is a thermally conductive silicone sheet with adhesive on both sides and has a thickness in a range of 0.1 mm to 0.25 mm. 4 . The integrated circuit of claim 1 , wherein the heat conductive medium is a thermally conductive fiberglass sheet with adhesive on both sides and has a thickness in a range of 0.1 mm to 0.25 mm. 5 . The integrated circuit of claim 1 , further comprising a heat dissipating fin set mounted on the micro-pores ceramic heat sink. 6 . The integrated circuit of claim 5 , further comprising a cooling fan mounted on the heat dissipating fin set.
BACKGROUND OF INVENTION [0001] 1. Field of Invention [0002] This invention relates to an integrated circuit using a micro-pores ceramic heat sink and more particularly to an integrated circuit having a micro-pores ceramic heat sink that can evenly dissipate the heat generated by an integrated circuit device toward surfaces of the micro-pores ceramics heat sink and therefore reduce the heat resistance and enhance the heat dissipation effect. [0003] 2. Related Prior Art [0004] A conventional heat sink for an integrated circuit device includes at least one metallic heat dissipating fin set and a cooling fan mounted on the metallic heat dissipating fin set. The metallic heat dissipating fin set is mounted on one side of the integrated circuit device via heat conductive adhesive. In this way, while the integrated circuit device operates and generates heat, the cooling fan guides airflow to the metallic heat dissipating fin set for heat dissipation. [0005] Although the prior heat sink can help to dissipate the heat generated by the integrated circuit device; however, since the heat conductive adhesive is the only heat conductive medium which serves to join the integrated circuit device and the metallic heat dissipating fin set together. Accordingly, when the metallic heat dissipating fin set is about to absorb the heat generated by the integrated circuit device, the heat resistance is quite high, which causes the heat not being able to be evenly dispersed to the metallic heat dissipating fin set. The heat dissipation effect is limited. The accumulated heat may cause a decrease in performance of the integrated circuit device or damage to the integrated circuit device. [0006] Another type of heat sink for an integrated circuit device is a micro-pores ceramics heat sink, as disclosed in Chaby Hsu U.S. Pat. No. 6,967,844. The micro-pores ceramics heat sink includes a thermal conductive layer, a heat dissipation layer and a cooling fan. The thermal conductive layer is provided to be mounted on a surface of a heat source to absorb heat from the heat source. The heat dissipation layer combines with the thermal conductive layer and has a micro-pores structure with hollow crystals to provide a relatively greater surface area. The cooling fan mounted on the heat dissipation layer to provide a forced convection effect. SUMMARY OF INVENTION [0007] Broadly stated the present invention is directed to an integrated circuit using a micro-pores ceramic heat sink along with a heat conductive medium for heat dissipation. The integrated circuit mainly includes an integrated circuit device, a micro-pores ceramic heat sink and a heat conductive medium. The micro-pores ceramic heat sink is disposed on a top surface of the integrated circuit device. The heat conductive medium is placed in between the integrated circuit device and the micro-pores ceramic heat sink with one surface joined to the integrated circuit device and the other surface joined to the micro-pores ceramic heat sink. In such a fashion, heat generated by the integrated circuit device would be evenly dispersed to relatively greater surfaces of the micro-pores ceramic heat sink, and thereby the resistance can be reduced and the heat dissipation effect is enhanced. [0008] The present invention and the advantages thereof will become more apparent upon consideration of the following detailed description when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS [0009] The invention is illustrated by the accompanying drawings in which corresponding parts are identified by the same numerals and in which: [0010] FIG. 1 is a perspective view of an integrated circuit in accordance with a first embodiment of the invention; [0011] FIG. 2 is an exploded view of the integrated circuit of FIG. 1 ; [0012] FIG. 3 is a perspective view of an integrated circuit in accordance with a second embodiment of the invention; [0013] FIG. 4 is a perspective view of an integrated circuit in accordance with a third embodiment of the invention; DETAILED DESCRIPTION OF EMBODIMENTS [0014] Turning in detail to the drawings, an integrated circuit according to a first embodiment of the invention is illustrated in FIGS. 1 and 2 . The integrated circuit comprises an integrated circuit device 1 , a micro-pores ceramic heat sink 2 and a heat conductive medium 3 . [0015] The integrated circuit device 1 may be a bare die or a packaged chip. The micro-pores ceramic heat sink 2 is placed on top of the integrated circuit device 1 . The heat conductive medium 3 is placed in between the integrated circuit device 1 and the micro-pores ceramic heat sink 2 with one surface joined to the integrated circuit device 1 and the other surface joined to the micro-pores ceramic heat sink 2 . [0016] The heat conductive medium 3 may be a thermally conductive tape, such as an aluminum foil tape, a silicone sheet or a fiberglass sheet, with adhesive on both sides and a thickness in a range of 0.1 mm to 0.25 mm. [0017] FIG. 3 provides a cross-sectional view of an integrated circuit in a second embodiment. As with the integrated circuit of FIG. 1 , the integrated circuit of FIG. 3 further includes a heat dissipating fin set 4 and a cooling fan 5 . The heat dissipating fin set 4 is disposed on top of the micro-pores ceramic heat sink 2 . The cooling fan 5 is mounted on top of the heat dissipating fin set 4 . Since the cooling fan 5 provides a forced convection effect, the micro-pores ceramic heat sink 2 along with the cooling fan 5 performs relative excellent heat dissipation effect. It is noted that the micro-pores ceramic heat sink 2 and the heat dissipating fin set 4 may be separately formed and mounted together. Alternatively, the micro-pores ceramic heat sink 2 and the heat dissipating fin set 4 may be formed in one piece with the same material via a molding process. [0018] While the integrated circuit device 1 operates and generates heat, the heat conductive medium 3 evenly transfers the heat to the surfaces of the micro-pores ceramic heat sink 2 . In this time, the heat resistance is reduced and the heat conductivity is enhanced. Afterward, the heat dissipating fin set 4 absorbs the heat from the micro-pores ceramic heat sink 2 and the cooling fan 5 guides airflow into the heat dissipating fin set 4 to disperse the heat. In this way, the present invention utilizes the characteristic of the micro-pores ceramic heat sink 2 with the help of the heat conductive medium 3 , the heat dissipating fin set 4 and the cooling fan 5 to perform an excellent heat dissipation effect. [0019] FIG. 4 provides a perspective view of an integrated circuit in a third embodiment. As with the integrated circuit of FIG. 1 , the integrated circuit of FIG. 4 further includes a plurality of fasteners 6 at corners thereof to secure the integrated circuit device 1 and the micro-pores ceramic heat sink 2 together. In this way, the bonding between integrated circuit device 1 and the micro-pores ceramic heat sink 2 are strengthened, and thereby enhances the heat dissipation effect. [0020] It will be appreciated that although a particular embodiment of the invention has been shown and described, modifications may be made. It is intended in the claims to cover such modifications which come within the spirit and scope of the invention.

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Patent Citations (22)

    Publication numberPublication dateAssigneeTitle
    US-2003015811-A1January 23, 2003Klett James W., Burchell Timothy D.Pitch-based carbon foam heat sink with phase change material
    US-2003123228-A1July 03, 2003Rakesh Bhatia, Eric DistefanoLow thermal resistance interface for attachment of thermal materials to a processor die
    US-2004018945-A1January 29, 2004Aos Thermal CompoundsDry thermal interface material
    US-2005111188-A1May 26, 2005Anandaroop Bhattacharya, Prasher Ravi S., Garcia Jerome L., Suzana PrsticThermal management device for an integrated circuit
    US-2006220058-A1October 05, 2006Avto TavkhelidzeMultiple tunnel junction thermotunnel device on the basis of ballistic electrons
    US-2006243997-A1November 02, 2006Yang Chun C, Hong-Xi Cao, Chia-Tai Kuo, Chih-Li Chen, Cheng-Fa Chen, Ji-Bin HorngHigh power LEDs
    US-2007013053-A1January 18, 2007Peter Chou, Bear ZhangSemiconductor device and method for manufacturing a semiconductor device
    US-2007080362-A1April 12, 2007Osram Sylvania Inc.LED with light transmissive heat sink
    US-2009056915-A1March 05, 2009Hua-Hsin TsaiElectrically insulated heat sink with high thermal conductivity
    US-4876588-AOctober 24, 1989Nec CorporationSemiconductor device having ceramic package incorporated with a heat-radiator
    US-5293301-AMarch 08, 1994Shinko Electric Industries Co., Ltd.Semiconductor device and lead frame used therein
    US-5455457-AOctober 03, 1995Nec CorporationPackage for semiconductor elements having thermal dissipation means
    US-5738936-AApril 14, 1998W. L. Gore & Associates, Inc.Thermally conductive polytetrafluoroethylene article
    US-5818105-AOctober 06, 1998Nec CorporationSemiconductor device with plastic material covering a semiconductor chip mounted on a substrate of the device
    US-5877553-AMarch 02, 1999Nhk Spring Co., Ltd.Metallic electronic component packaging arrangement
    US-5948521-ASeptember 07, 1999Siemens AktiengesellscahftThermally conductive, electrically insulating connection
    US-6046907-AApril 04, 2000Kitigawa Industries Co., Ltd.Heat conductor
    US-6165612-ADecember 26, 2000The Bergquist CompanyThermally conductive interface layers
    US-6548895-B1April 15, 2003Sandia CorporationPackaging of electro-microfluidic devices
    US-6705393-B1March 16, 2004Abc Taiwan Electronics Corp.Ceramic heat sink with micro-pores structure
    US-6967844-B2November 22, 2005Abc Taiwan Electronics Corp.Ceramic heat sink with micro-pores structure
    US-7219713-B2May 22, 2007International Business Machines CorporationHeterogeneous thermal interface for cooling

NO-Patent Citations (0)

    Title

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    Publication numberPublication dateAssigneeTitle
    US-2013220676-A1August 29, 2013Tyk Corporation, Kitagawa Industries Co., Ltd.Electronic circuit and heat sink
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